Electrodeposition for the synthesis of microsystems

W. Ruythooren; K. Attenborough; S. Beerten; P. Merken; J. Fransaer; E. Beyne; C. Van Hoof; J. De Boeck; J. P. Celis

doi:10.1088/0960-1317/10/2/301

Electrodeposition for the synthesis of microsystems

W. Ruythooren
, K. Attenborough
, S. Beerten
, P. Merken
, J. Fransaer
, E. Beyne
, C. Van Hoof
, J. De Boeck
, J. P. Celis

Communication, Information, Systems and Sensors

KU Leuven
Interuniversitair Micro-Electronica Centrum vzw

Résultats de recherche: Contribution à un journal › Article de conférence › Revue par des pairs

80 Citations (Scopus)

Résumé

Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.

langue originale	Anglais
Pages (de - à)	101-107
Nombre de pages	7
journal	Journal of Micromechanics and Microengineering
Volume	10
Numéro de publication	2
Les DOIs	https://doi.org/10.1088/0960-1317/10/2/301
état	Publié - juin 2000
Evénement	The 10th Micromechanics Europe Workshop (MME'99) - Gif sur Yvette, France Durée: 27 sept. 1999 → 28 sept. 1999

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@article{05e116f21bef476f876834a8c793cbd9,

title = "Electrodeposition for the synthesis of microsystems",

abstract = "Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.",

author = "W. Ruythooren and K. Attenborough and S. Beerten and P. Merken and J. Fransaer and E. Beyne and \{Van Hoof\}, C. and \{De Boeck\}, J. and Celis, \{J. P.\}",

year = "2000",

month = jun,

doi = "10.1088/0960-1317/10/2/301",

language = "English",

volume = "10",

pages = "101--107",

journal = "Journal of Micromechanics and Microengineering",

issn = "0960-1317",

number = "2",

note = "The 10th Micromechanics Europe Workshop (MME'99) ; Conference date: 27-09-1999 Through 28-09-1999",

}

TY - JOUR

T1 - Electrodeposition for the synthesis of microsystems

AU - Ruythooren, W.

AU - Attenborough, K.

AU - Beerten, S.

AU - Merken, P.

AU - Fransaer, J.

AU - Beyne, E.

AU - Van Hoof, C.

AU - De Boeck, J.

AU - Celis, J. P.

PY - 2000/6

Y1 - 2000/6

N2 - Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.

AB - Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.

UR - https://www.scopus.com/pages/publications/0033700462

U2 - 10.1088/0960-1317/10/2/301

DO - 10.1088/0960-1317/10/2/301

M3 - Conference article

AN - SCOPUS:0033700462

SN - 0960-1317

VL - 10

SP - 101

EP - 107

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

IS - 2

T2 - The 10th Micromechanics Europe Workshop (MME'99)

Y2 - 27 September 1999 through 28 September 1999

ER -

Electrodeposition for the synthesis of microsystems

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