Thermal-electrical-mechanical coupled FE buckling analysis of smart plates using discrete layer kinematics

G. Giannopoulos, F. Santafe Iribarren, J. Vantomme

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    Abstract

    In the present work, the non-linear analysis of smart beams and plates is performed, using FE techniques. A coupled constitutive formulation between thermal, electrical and mechanical fields is presented incorporating non-linearity due to large displacements. An 8-node plate element was implemented in combination with a discrete layer approximation (LW) for the through the thickness representation of the structure. The issues of the critical buckling load under different electrical conditions as well as thermal and electrical loading are also presented. Experimental results contribute in order to verify the numerical analysis results.

    Original languageEnglish
    Title of host publicationSmart Structures and Materials 2006
    Subtitle of host publicationModeling, Signal Processing, and Control
    DOIs
    Publication statusPublished - 2006
    EventSmart Structures and Materials 2006: Modeling, Signal Processing, and Control - San Diego, CA, United States
    Duration: 27 Feb 20062 Mar 2006

    Publication series

    NameProceedings of SPIE - The International Society for Optical Engineering
    Volume6166
    ISSN (Print)0277-786X

    Conference

    ConferenceSmart Structures and Materials 2006: Modeling, Signal Processing, and Control
    Country/TerritoryUnited States
    CitySan Diego, CA
    Period27/02/062/03/06

    Keywords

    • Buckling
    • Finite element analysis
    • Layerwise mechanics
    • Thermal-electrical-mechanical buckling

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