Hybrid and monolithic infrared detector arrays

C. Van Hoof; L. Zimmermann; J. John; P. De Moor; S. Kavadias; M. Gastal; S. Németh; G. Borghs; P. Merken

doi:10.1117/12.417784

Hybrid and monolithic infrared detector arrays

C. Van Hoof, L. Zimmermann, J. John, P. De Moor, S. Kavadias, M. Gastal, S. Németh, G. Borghs, P. Merken

Communication, Information, Systems and Sensors

IMEC

Research output: Contribution to journal › Conference article › peer-review

Abstract

Infrared detector arrays can be divided in two distinct classes: hybrid (and typically photon) detectors and monolithic (and generally thermal) detectors. Hybrid detectors involve flip-chip integration of the detector array and the readout chip, require cooling and thus cause substantial system cost. Monolithic detectors do not suffer this system overhead and most notably the microbolometer thermal detectors allow ambient operating temperature. IMEC focuses on III-V (InGaAs, InAs and InAsSb) short-wave and mid-infrared detector arrays for hybrid integration on one side and surface-micromachined uncooled polySiGe microbolometer arrays on the other hand. Progress in both types of detector systems is reported.

Original language	English
Pages (from-to)	23-31
Number of pages	9
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4355
DOIs	https://doi.org/10.1117/12.417784
Publication status	Published - 2001
Event	5th International Conference on Material Science and Mateial Propoerties for Infrared Optoelectronics - Kiev, Ukraine Duration: 22 May 2000 → 24 May 2000

Keywords

Hermetic packaging
Hybrid integration
IR detection
Surface micromachining
Uncooled bolometers

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10.1117/12.417784

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title = "Hybrid and monolithic infrared detector arrays",

abstract = "Infrared detector arrays can be divided in two distinct classes: hybrid (and typically photon) detectors and monolithic (and generally thermal) detectors. Hybrid detectors involve flip-chip integration of the detector array and the readout chip, require cooling and thus cause substantial system cost. Monolithic detectors do not suffer this system overhead and most notably the microbolometer thermal detectors allow ambient operating temperature. IMEC focuses on III-V (InGaAs, InAs and InAsSb) short-wave and mid-infrared detector arrays for hybrid integration on one side and surface-micromachined uncooled polySiGe microbolometer arrays on the other hand. Progress in both types of detector systems is reported.",

keywords = "Hermetic packaging, Hybrid integration, IR detection, Surface micromachining, Uncooled bolometers",

author = "{Van Hoof}, C. and L. Zimmermann and J. John and {De Moor}, P. and S. Kavadias and M. Gastal and S. N{\'e}meth and G. Borghs and P. Merken",

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doi = "10.1117/12.417784",

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pages = "23--31",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

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TY - JOUR

T1 - Hybrid and monolithic infrared detector arrays

AU - Van Hoof, C.

AU - Zimmermann, L.

AU - John, J.

AU - De Moor, P.

AU - Kavadias, S.

AU - Gastal, M.

AU - Németh, S.

AU - Borghs, G.

AU - Merken, P.

PY - 2001

Y1 - 2001

N2 - Infrared detector arrays can be divided in two distinct classes: hybrid (and typically photon) detectors and monolithic (and generally thermal) detectors. Hybrid detectors involve flip-chip integration of the detector array and the readout chip, require cooling and thus cause substantial system cost. Monolithic detectors do not suffer this system overhead and most notably the microbolometer thermal detectors allow ambient operating temperature. IMEC focuses on III-V (InGaAs, InAs and InAsSb) short-wave and mid-infrared detector arrays for hybrid integration on one side and surface-micromachined uncooled polySiGe microbolometer arrays on the other hand. Progress in both types of detector systems is reported.

AB - Infrared detector arrays can be divided in two distinct classes: hybrid (and typically photon) detectors and monolithic (and generally thermal) detectors. Hybrid detectors involve flip-chip integration of the detector array and the readout chip, require cooling and thus cause substantial system cost. Monolithic detectors do not suffer this system overhead and most notably the microbolometer thermal detectors allow ambient operating temperature. IMEC focuses on III-V (InGaAs, InAs and InAsSb) short-wave and mid-infrared detector arrays for hybrid integration on one side and surface-micromachined uncooled polySiGe microbolometer arrays on the other hand. Progress in both types of detector systems is reported.

KW - Hermetic packaging

KW - Hybrid integration

KW - IR detection

KW - Surface micromachining

KW - Uncooled bolometers

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DO - 10.1117/12.417784

M3 - Conference article

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VL - 4355

SP - 23

EP - 31

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - 5th International Conference on Material Science and Mateial Propoerties for Infrared Optoelectronics

Y2 - 22 May 2000 through 24 May 2000

ER -

Hybrid and monolithic infrared detector arrays

Abstract

Keywords

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