Abstract
Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.
| Original language | English |
|---|---|
| Pages (from-to) | 101-107 |
| Number of pages | 7 |
| Journal | Journal of Micromechanics and Microengineering |
| Volume | 10 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - Jun 2000 |
| Event | The 10th Micromechanics Europe Workshop (MME'99) - Gif sur Yvette, France Duration: 27 Sept 1999 → 28 Sept 1999 |
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