TY - JOUR
T1 - Electrodeposition for the synthesis of microsystems
AU - Ruythooren, W.
AU - Attenborough, K.
AU - Beerten, S.
AU - Merken, P.
AU - Fransaer, J.
AU - Beyne, E.
AU - Van Hoof, C.
AU - De Boeck, J.
AU - Celis, J. P.
PY - 2000/6
Y1 - 2000/6
N2 - Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.
AB - Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.
UR - http://www.scopus.com/inward/record.url?scp=0033700462&partnerID=8YFLogxK
U2 - 10.1088/0960-1317/10/2/301
DO - 10.1088/0960-1317/10/2/301
M3 - Conference article
AN - SCOPUS:0033700462
SN - 0960-1317
VL - 10
SP - 101
EP - 107
JO - Journal of Micromechanics and Microengineering
JF - Journal of Micromechanics and Microengineering
IS - 2
T2 - The 10th Micromechanics Europe Workshop (MME'99)
Y2 - 27 September 1999 through 28 September 1999
ER -