A fully thermoelectromechanicaly coupled FE analysis for the dynamic behavior of smart plates using discrete-layer kinematics

G. Giannopoulos, J. Vantomme

    Research output: Contribution to journalConference articlepeer-review

    Abstract

    Due to the extended application of piezoelectrics into a number of high performance structures, the necessity for accurate analysis of their behavior is of critical importance. In this work the dynamic analysis of a composite plate incorporating piezoelectric layers is presented. A 4-node plate finite element is developed. Discrete layer kinematic assumptions in combination with a thermal-electrical-mechanical coupled formulation takes place. This formulation enables the investigation of the response of a structure under the influence of different thermal and electrical conditions. Additionally, in order to investigate whether the kinematics assumptions implemented here are capable of capturing with accuracy the dynamic performance of both thin and thick structures, plates of different thicknesses are investigated.

    Original languageEnglish
    Article number42
    Pages (from-to)420-431
    Number of pages12
    JournalProceedings of SPIE - The International Society for Optical Engineering
    Volume5757
    DOIs
    Publication statusPublished - 2005
    EventSmart Structures and Materials 2005 - Modeling, Signal Processing, and Control - San Diego, CA, United States
    Duration: 7 Mar 20059 Mar 2005

    Keywords

    • Eigenvalues
    • Electrical-thermal coupling
    • Finite element
    • Piezoelectrics
    • Thermal-mechanical coupling

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