Engineering
Bond Number
7%
Ceilings
7%
Cluster Size
29%
Colloidal Particle
14%
Computer Simulation
46%
Contact Line
79%
Drying
22%
Dynamic Contact Angle
43%
Elastic Stress
14%
Equilibrium Contact Angle
19%
Experimental Result
14%
Good Agreement
22%
Harmonics
8%
Hydrodynamics
31%
Image Analysis
14%
Impact Velocity
14%
Increasing Strain
7%
Interaction Potential
24%
Internal Pressure
7%
Kinetic Study
14%
Liquid Bridges
14%
Liquid Film
7%
Liquid Molecule
11%
Liquid System
14%
Macroscopic Model
9%
Magnetic Field
14%
Master Curve
9%
Max
14%
Microsphere
14%
Molecular Scale
37%
Monolayers
14%
Nanometre
31%
Nanoscale
8%
Oscillatory
36%
Particle Concentration
9%
Polydispersity
14%
Radial Distribution
7%
Remnant Magnetization
14%
Repulsive Interaction
14%
Rheological Behavior
7%
Shear Flow
9%
Smoluchowski Equation
14%
Solid Plate
18%
Strain Amplitude
7%
Tangential Component
14%
Tangential Force
12%
Two Dimensional
14%
Ultrasonics
14%
Work of Adhesion
12%
Young Equation
29%
Material Science
Colloidal Suspension
14%
Contact Angle
100%
Density
22%
Dilution
7%
Dynamics of Wetting
28%
Hydrodynamics
36%
Liquid Interface
8%
Magnetic Fluid
44%
Magnetorheological Fluid
58%
Microsphere
7%
Monolayers
29%
Self Assembly
14%
Shear Flow
14%
Silicone Oil
7%
Solid Interface
14%
Surface (Surface Science)
60%
Surface Tension
43%
Wettability
17%
Yield Stress
14%