Abstract
Electroplating is an emerging technique for the production of microsystems. This is due to advantages such as high rate of deposition, high resolution, high shape fidelity, simple scalability, and good compatibility with existing processes in microelectronics. Materials ranging from high-conductivity metals over soldering connections to ferromagnets can be deposited. In this paper the basics of electroplating are reviewed and examples of recent applications of electroplating in the processing of microsystems are presented.
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 101-107 |
| Seitenumfang | 7 |
| Fachzeitschrift | Journal of Micromechanics and Microengineering |
| Jahrgang | 10 |
| Ausgabenummer | 2 |
| DOIs | |
| Publikationsstatus | Veröffentlicht - Juni 2000 |
| Veranstaltung | The 10th Micromechanics Europe Workshop (MME'99) - Gif sur Yvette, France Dauer: 27 Sept. 1999 → 28 Sept. 1999 |
Fingerprint
Untersuchen Sie die Forschungsthemen von „Electrodeposition for the synthesis of microsystems“. Zusammen bilden sie einen einzigartigen Fingerprint.Dieses zitieren
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver