Abstract
In the present work, toughness of unfilled polyamide 6,6 (PA66) and short glass fibre reinforced polyamide 6,6 (SGFR-PA66) was investigated. Digital image correlation (DIC) was used with a single camera for in-plane displacement field measurement and then strain computation. The results allowed to extract the resistance curve for the PA66 and critical stress intensity factors, KIc, for the SGFR-PA66 with three glass fibre contents (15%, 30% and 50% (wt)) and under room temperature (20 °C). The tests were carried out on single edge notched tension (SENT) specimens. The DIC technique allowed to precise the spatial distribution of the local strains in a defined region including the crack tip at different steps of the loading. Scanning electron microscopy observations illustrated different damage mechanisms occurring in the studied composites: matrix crack, fibre-matrix interface failure and fibres pull out.
| Originalsprache | Englisch |
|---|---|
| Seiten (von - bis) | 2521-2526 |
| Seitenumfang | 6 |
| Fachzeitschrift | Composites Science and Technology |
| Jahrgang | 69 |
| Ausgabenummer | 15-16 |
| DOIs | |
| Publikationsstatus | Veröffentlicht - Dez. 2009 |
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